"Welcome, Micron Technology, to Gujarat," says Deputy Chief Minister Harsh Sanghavi ahead of ATMP plant inauguration on February 28
New Delhi [India], February 27 (ANI): Gujarat Deputy Chief Minister Harsh Sanghavi hosted a welcome dinner for Micron Technology President and CEO Sanjay Mehrotra and senior members of the semiconductor leadership team on Friday, ahead of the historic inauguration of the company's facility scheduled for tomorrow.
In a post on X, Sanghavi stated, "Welcome, Micron Technology, to Gujarat! Had a warm welcome dinner with President & CEO Sanjay Mehrotra and senior members of the Micron semiconductor leadership team ahead of the historic inauguration tomorrow. Our collaboration is already strong, and tomorrow Hon'ble Prime Minister @narendramodi will inaugurate the Micron plant in Gujarat a landmark moment for India's semiconductor journey."
Micron Semiconductor Technology India Pvt. Ltd. has invested Rs 22,516 crore. The launch of this ATMP facility in the state marks the beginning of a new chapter in India's semiconductor journey, the release said.
The ATMP facility will manufacture SSD Solid State Drive storage devices, as well as RAM type DRAM and NAND products. At present, 2,000 people are working in the facility. Eventually, 5,000 direct employment opportunities will be created.
Sanjay Mehrotra, Chairman, President and CEO of Micron Technology, stated that memory and storage are central to today's technology, particularly in the artificial intelligence (AI) field.
As per the release, the functioning of an ATMP plant begins with wafer chips. The process starts with sand, from which pure silicon is extracted. The silicon is melted and shaped into a cylinder called an ingot. This ingot is then sliced into thin discs known as wafers. At the fabrication plant, electronic patterns are printed on these wafers, and multiple layers are added.
The chips then reach the ATMP plant. Here, they are first assembled. In the next stage, they undergo detailed testing to check speed, memory capacity and overall performance. After testing, the chips are marked with the necessary details and finally packaged and ready for the market.
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